# Summary
Tanaka establishes transfer technology for its sintered gold bonding technology
Electronic Products & Technology2026.03.06Updated 39d ago
The seamless application on substrates with complex shapes will improve semiconductor performance through enhanced miniaturization of wiring and greater integration for various types of chips
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Tanaka has developed transfer technology for its sintered gold bonding process, enabling application on substrates with complex shapes. This innovation improves semiconductor performance by allowing greater miniaturization of wiring and increased chip integration, advancing manufacturing capabilities across various semiconductor types.
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